Tensile Test for Metallic Materials Using Strain Rate Control and Stress Rate Control
Electronics, Electronic
Electronic devices and semiconductor technologies supports a variety of industries and add comfort to our lives. Shimadzu develops and manufactures a wide range of instruments to help the quality control of the electronic devices and complying with RoHS.
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Electronics/Electronic device
Glass, Cement, Ceramics, Other nonorganic material
Li-ion Battery
Other Cell
Regulatory Test (RoHS, ELV, REACH, etc)
Semi-conductor, Electronic parts, Mounting board
- Circuit Board Cyclic Bending Strength and Resistance Evaluation (Lead-Free Solder)
- Metal Migration on Printed Circuit Boards
- Observation of Defects in ICs
- IC Surface Observations
- Observation of Deformation, Cracks, Voids, and Joints of Solder Balls
- Analysis of Trace Oganic Matter Adhered to Wafers
- Analysis of Trace Organic Foreign Matter on IC Chips
- Cross-Sectional Observations of Silicon Wafer Thin Films
- Film Thickness Measurement of Photoresist Thin Film on Silicon Wafer Surface (UV)
- Analysis of SiO2 Thin Films on Silicon Wafers (FTIR)
- Peeling Resistance Testing of BGA Chips
- Peeling Testing of Soldered Joints
- Analysis of Trace Inorganic Ions in Semiconductor Washing Water
- Management of Plating Solutions
- Analysis of Air in Cleanrooms
- Measurement of Transmittance and Reflectance Spectra of Optical Materials (UV)
- Carbon Nanotube | Diameter | Calculation from RBM Wavenumber
- Carbon Nanotube | Diameter | Comparison of CNTs Made by Different Production Methods
- Carbon Nanotube | Purity Evaluation by G/D Ratio
- Carbon Nanotube | Chirality of SWNT
- Carbon Nanotube | Abundance Distributions | Mapping of CNT FET
- Failure Analysis of Automobile Parts (X-ray CT)
- Thermal Expansion Measurements of Printed Circuit Boards (TMA)
- Melting Measurements on Lead-Free Solder (TA)