Product

Industrial Equipment

Multi deposition system

Multi Deposition System

DLC-MR3

DLC-MR3

Diamond like carbon deposition technology using Shimadzu ECR-CVD has fulfilled the needs of many users in the area of MR/GMR head protective film. The DLC-MR3 - as the successor to the highly popular DLC-MR2 - is the latest DLC deposition system for MR/GMR heads and incorporates many features to support user needs. In other words, with the production orientated ECR plasma source, various features - including support of 8-inch substrates, use of a cluster module system with excellent expandability, improved film thickness uniformity in each process, use of a highly reliable transfer system, and provision of user friendly software - have been brought together for the high-quality DLC film; furthermore, next-generation ultra thin film is also possible.

Features

  • Throughput and film thickness uniformity in each process have been improved through the use of an 8-inch diameter support chamber.
  • A cluster module system with excellent expandability is used.
  • Deposition direction for all processes has been set to a face down direction to reduce particles.
  • A highly reliable transfer robot is used to improve reliability in the transfer system.
  • A cryopump is used in the transfer chamber to improve pumping speed of H2O.
  • The front cover is made of SUS only and an ionizer has been installed in the cassette uptake unit for electric static discharge (ESD).
  • User friendly software - making use of Shimadzu's wealth of experience - has been developed.
  • Not only is machine easy to operate, but it is also replete with data logging function to support production control and quality control.
  • Through the wall installation is possible.

Main Specifications

Cycle Time

10 min (for cleaning, Si 2 nm, DLC 5 nm)

Processable substrates

Size: 200 dia. or less
Weight: Max. 1500 g (including specially designed adapter of 500 g)

Deposition system (All face-down processes)

DLC: ECR-CVD
Si: DC magnetron sputtering
Cleaning: RF parallel plate sputtering/etching

Dimensions

Deposition system: W 2400 x D 2270 x H 1900 mm
Control unit: W 570 x D 900 x H 2000 mm