Product

Process 1: Si substrate surface cleaning

Evaluation method / Instrument required:

• Organic contaminant measurements on surface after cleaning / FTIR
• Si substrate hardness and strength measurements / DUH

Process 2: Removing surface-damaged layer

Evaluation method / Instrument required:

• Impurity measurements on etching solutions / ICP

Process 3: Texturing to enhance light trapping effect

Process 4: n-layer formation by p diffusion

Evaluation method / Instrument required:

• P quantification on n-type Si substrate surface / FTIR

Process 5: PSG elimination

Process 6: Forming anti-reflective film

Evaluation method / Instrument required:

• Reflectance and transmission measurements / SolidSpec
• Evaluation of Si-H bonds / FTIR

Process 7: Forming front and back electrodes, firing

Evaluation method / Instrument required:

• Foreign matter analysis in anti-reflective films / EPMA
• Cell reflectance and transmission measurements / SolidSpec
• Evaluation of crystallographic structure of Ag electrode materials / XRD
• Firing process of front electrode / SEM
• Compression testing of front electrode / MCT
• Flow property testing of electrode paste / CFT

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