July 22, 2013 | News & Notices Shimadzu Launches inspeXio SMX-225CT FPD Microfocus X-Ray CT System - Offers sharp, high-contrast, 3D observation of lithium-ion batteries, die-cast aluminum parts, electrical and electronic components -

inspeXio SMX-225CT FPD Microfocus X-Ray CT System

Shimadzu Corporation introduces inspeXio SMX-225CT FPD Microfocus X-Ray CT System - a new model added to the best-selling range of Industrial X-Ray CT Systems. The new product offers sharp, high-contrast, three-dimensional observation of the internal structure of lithium-ion batteries, die-cast aluminum parts, electrical and electronic components.

Microfocus X-ray CT systems rotate the sample between a microfocus X-ray generator and an X-ray detector toreconstruct three-dimensional internal structure of the sample based on the imaging data. These systems are used in a wide range of industries for study of internal structures, defects, failure analysis, shape measurements and inspections.

The inspeXio SMX-225CT is the flagship model in its series. The product comes equipped with an X-ray flat panel detector and incorporates the HPC inspeXio high-performance computing system as standard. The X-ray flat panel detector achieves a wider dynamic range than the X-ray detectors in previous models and allows the user to obtain sharp, high-contrast images, even of samples comprising materials with significant differences in specific gravity, such as lithium-ion batteries and electrical components made of both metals and plastics. It is also suitable for imaging die-cast aluminum parts for which the brightness of the X-ray transmission images differs according to the direction of observation and the position within the field of view.

The use and mass production of lithium-ion batteries and die-cast aluminum parts has increased in recent years due to the implementation of energy saving and fuel economy measures. This is expected to lead to increased demand for rapid and accurate non-destructive testing using microfocus X-ray CT systems.

CT imaging of samples containing materials such as metals, that do not readily transmit X-rays can result in artifacts, known as metal artifacts or beam-hardening artifacts, which reduce the quality of CT images. High-accuracy inspection demands a reduction in the artifacts that hinder observation of plastic separators inside a metal lithium-ion battery case or of defects in die-cast aluminum parts, for example.

The inspeXio SMX-225CT FPD adopts an X-ray flat panel detector with a wide dynamic range that uses high-output X-rays to suppress artifacts. It also features a high-performance computing system to achieve ultrafast image reconstruction, making it possible to produce clear CT images rapidly.

Key Features

1. Sharp, High-Contrast Images

The product comes equipped with a new flat panel detector with a wide dynamic range and incorporates a new image-processing engine that extracts maximum detector performance. It can produce sharp, high-contrast CT images with reduced artifacts, even of samples that do not readily transmit X-rays and are conventionally difficult to image.

2. HPC inspeXio High-Performance Computing System as Standard

A data-processing system employing the latest high-performance computing (HPC) technology achieves about 80 to 170 times faster computational processing than previous Shimadzu products. The time from completion of data acquisition to data display is dramatically reduced from 840 seconds (depending on scanning conditions) for a previous Shimadzu product to about 5 to 10 seconds.

3. Wider Scan Area and Larger Sample Size

Compared to previous products, the scan area is increased by about 25% to 250 mm diameter and the maximum mountable sample size is increased by 15% to 350 mm. This allows wide-field observation of large samples that could not be handled previously. This single system handles a wide range of samples from increasingly miniaturized electronic devices to automobile die-cast parts.

Observation Examples