Observation of Defects in ICs
Non-destructive X-ray inspection systems offer non-destructive observations of the internal structures of objects. They are effective systems for identifying the cause of failure of industrial products.
X-ray observations are effective for observing the interior of resin-sealed ICs that cannot be viewed externally. This shows the observation of a defect in an integrated circuit (IC).
The CT image reveals that two of the bonding wires inside the IC are damaged.
Provide non-destructive, high-magnification X-ray transmission images of the interior of objects. These systems can be applied to internal failure analysis, reliability evaluation, and analysis of surface mounting technologies.
Shimadzu offers a range of products for high-magnification inspections with a world-leading microfocus size 1 µm.