Film Thickness Measurement of Photoresist Thin Film on Silicon Wafer Surface (UV)
Many methods are available to measure the thickness of a film. Of these, UV-VIS spectroscopy offers easy, non-destructive film thickness measurements.
Photoresist layers of two different thicknesses (0.5 µm, 3.0 µm) on a silicon wafer were measured. The thinner the film, the longer the wave period, and vice-versa.
Permits easy, non-destructive thickness measurements on all types of film. Light reflected from the front and rear surfaces of the film interferes to form an interference pattern. The film thickness can be determined by counting the number of waves on the spectrum within a certain wavelength range (if the refractive index of the substance is known).