Quantitative Analysis of Film Thicknesses of Multi-Layer Plating Used on Cards

X-ray fluorescence spectrometry enables non-destructive analyses of the composition and the amount of deposition of various coatings including metal plating and sputter coating. As an example of an analysis of familiar electronic components, we quantitatively analyzed each film of the three-layer Au/Ni/Cu plating of an IC chip and a SIM card using the thin-film fundamental parameter (FP) method.
This article introduces an example of a simple analysis that was performed with high sensitivity and accuracy without creating calibration curves.

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Elemental Analysis, Energy Dispersive X-ray Fluorescence Spectroscopy, Atomic Absorption Spectroscopy
Thin-film FP method, Plating, Multi-layer, Lamination layer, Film thickness, Gold (Au), Nickel (Ni), Copper (Cu), Electronics, Electronic, Environment, Hydrocarbon Processing Industry (Petrochemical, Chemical), Soil, Fertilizer, Waste Material Test, Plating, Metals, EDX-8000
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