EDXRF Analysis of Lead, Cadmium, Silver, Copper in Lead-Free Solder Materials

X-ray fluorescence analysis can be used to quicklyand easily analyze samples in solid, powder, andliquid states nondestructively, and is therefore widelyused as a screening technique for compliance with theRoHS/ELV directives. A large amount of lead-freesolder is used for surface-mount circuit boards. Herewe evaluated the sensitivity of analysis of Pb, Cd, Ag,and Cu in lead-free solder reference materials certifiedby the Japan Society for Analytical Chemistry, andreported those results.

Content Type:
Application
Document Number:
LAAN-A-XR-E010
Product Type:
Elemental Analysis, Energy Dispersive X-ray Fluorescence Spectroscopy
Keywords:
Electronics, Electronic, Electronics/Electronic device, Semi-conductor, Electronic parts, Mounting board, Printed Circuit Board, EDX-GP, EDX-720
Language:
English
File Name:
x239.pdf
File Size:
712kb

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For Research Use Only. Not for use in diagnostic procedures.

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