An Example Observation of a Smartphone Using Xslicer SMX-6000

This article introduces an example observation of a smartphone using Xslicer SMX-6000. Images of internal components were acquired by fluoroscopic observation and CT observation as appropriate. Various inspections were performed depending on the observation section including individual layer observation, void analysis based on area, and void analysis based on volume. Xslicer SMX-6000 enables various observations and analyses in accordance with the inspection purpose.

Content Type:
Application
Document Number:
LAAN-A-ND-E021
Product Type:
Non-Destructive Testing
Keywords:
Electric/electronic, Electronic circuit board, Fluoroscopic observation, CT observation, BGA, Void, Electronics, Electronic, Semi-conductor, Electronic parts, Mounting board, Xslicer SMX-6000
Language:
English
File Name:
jpm318001.pdf
File Size:
2,900kb

View Article

For Research Use Only. Not for use in diagnostic procedures.

This page may contain references to products that are not available in your country. Please contact us to check the availability of these products in your country.

Top of This Page