An Example Observation of a Smartphone Using Xslicer SMX-6000
This article introduces an example observation of a smartphone using Xslicer SMX-6000. Images of internal components were acquired by fluoroscopic observation and CT observation as appropriate. Various inspections were performed depending on the observation section including individual layer observation, void analysis based on area, and void analysis based on volume. Xslicer SMX-6000 enables various observations and analyses in accordance with the inspection purpose.
- Content Type:
- Application
- Document Number:
- LAAN-A-ND-E021
- Product Type:
- Non-Destructive Testing
- Keywords:
- Electric/electronic, Electronic circuit board, Fluoroscopic observation, CT observation, BGA, Void, Electronics, Electronic, Semi-conductor, Electronic parts, Mounting board, Xslicer SMX-6000
- Language:
- English
- File Name:
- jpm318001.pdf
- File Size:
- 2,900kb