A Soldering Defect Inspection Using the Automatic Measurement System of SMX-1000 Plus

This article introduces an example of an observation of a large mounted circuit board using Xslicer SMX-6000. The inspection was performed mainly by fluoroscopic observation while inclined CT observation was used for sections with multiple layers that are difficult to observe by fluoroscopic observation. When performing inspections with SMX-6000, the operator can switch between fluoroscopic and CT observations seamlessly. In addition, the system enables high magnification CT observation of large plate/sheet workpieces. (However, workpieces must be cut for orthogonal CT imaging.)