Analysis of Lead-Free Solder Joint Interface

In the examples introduced here, the solder joint interface of a printed wiring board in which a lead-free solder alloy (Sn-3.0Ag-0.5Cu) was used in mounting and a crack in the solder were analyzed. An analysis using an electron probe microanalyzer (EPMA) revealed that heterogenous intermetallic compounds and a P-rich layer had formed at the joint interface between the solder and the electroless Ni-P plating. In the analysis of the solder crack, intermetallic compounds were detected in the joint between the solder and Ni plating, and a Cu- and Ag-depleted layer existed in its vicinity. Thus, EPMA analysis provided useful information for investigation of decreased solder joint strength and analysis of the deposition reaction process.

Content Type:
Application
Document Number:
P107
Product Type:
Surface Analysis
Keywords:
Lead-free solder, electrical and electronic, printed wiring board, crack, electroless nickel plating, electroless Ni-P plating, intermetallic compounds, high P concentration layer, P-rich layer, element, mapping, electron probe microanalyzer, EPMA, overlay, Electronics, Electronic, Hydrocarbon Processing Industry (Petrochemical, Chemical), Plating, Metals, EPMA-8050G
Language:
English
File Name:
jpq120001.pdf
File Size:
1,535kb

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