Analysis of Micro Ag Particles of Lead-Free Solder
This article introduces the high resolution X-ray images that are possible only with FE-EPMA and the difference in the distribution of microparticles when the accelerating voltage is changed based on an example of an analysis of a solder joint on a printed circuit board soldered with a lead-free solder (Sn-3.0Ag-0.5Cu). Measurements show spatial resolution of 100 nm or less when conducted under a low accelerating voltage condition (7 kV) to prevent spread of spatial resolution. It is also possible to acquire information in the depth direction by changing the accelerating voltage and obtain a specialized distribution for the shallow region of the sample surface by setting a low accelerating voltage.
- Content Type:
- Application
- Document Number:
- P109
- Product Type:
- Surface Analysis
- Keywords:
- Lead-free solder, electrical and electronic, printed circuit board, crack, plating, intermetallic compounds, element, mapping, electron probe microanalyzer, EPMA, line analysis, spatial resolution, electron scatter volume, primary X-ray emission volume, Monte Carlo simulation, Electronics, Electronic, Hydrocarbon Processing Industry (Petrochemical, Chemical), Plating, Metals, EPMA-8050G
- Language:
- English
- File Name:
- jpq120007.pdf
- File Size:
- 2,205kb