3D-DIC Analysis in Impact Test of Silicon Wafer

In an impact test of Si wafers, 3D-DIC analysis was performed by synchronized recording with two Shimadzu HPV-X2 high-speed video cameras. 3D-DIC analysis enables measurement of the surface displacement of the wafers. Because the destruction of Si wafers is an extremely rapid phenomenon that cannot be observed visually, observation with the HPV-X2 cameras is appropriate. For 3D-DIC, high-speed video cameras capable of high-resolution recording even at a high recording speed are necessary. The HPV-X2 camera is suitable for this application.