Bonding Strength Evaluation/Tensile Strength Evaluation of Bonding Wire

Tensile testing of bonding wire (30 µm dia.) in ICs: The test sample is positioned visually using the stereo microscope and X-Y stage (both options). The bonding wire is grasped by the optional micro-chuck.
The tensile strength of bonding wire was conventionally tested by applying the test force through a hook that is hooked onto the wire. However, in this example, the Micro Autograph can evaluate the wire joint strength separately on both the chip and leads using the micro-chuck.

Bonding Wire Tensile Test S-S Curve
(Lead Side)

Bonding Wire Tensile Test S-S Curve
(Chip Side)

* Appearance and specifications are subject to change without notice.

Properties Evaluation of Metal Foil

Compression test of speaker diaphragm: In this example, the truncated cone indenter with a tip diameter of 500 µm was pressed into the center of the thin speaker diaphragm.
Even small displacements can be measured stably, and the elasticity properties of diaphragms and foil are accurately evaluated.

Speaker Vibration Plate Compression S-S Curve

* Appearance and specifications are subject to change without notice.