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Universal testing
machine
Copper foil peel test device
Thermostatic
chamber
10 mm 30 mm
100 mm
2 mm
Substrate
Plating seed layer
Electrolytic copper
plating
(a) (b)
Fig. 2 Instruments
(a) Universal testing machine, Thermostatic chamber
(b) Copper foil peel test device
Testing machine : AGX-50NV2D
Load cell : 50 N
Jig : Copper foil peel test device
Thermostatic chamber : Refrigerator thermostatic chamber,
air-cooled type TCR2A
Software : TRAPEZIUM X-V
Fig. 1 Test Sample
(a) Dimensions, (b) Cross section
Fig. 1 shows the dimensions and cross section of the sample
used in the measurement. Polybutylene terephthalate (PBT),
which is a hard-to-plate resin, was used as the substrate. As a
method for plating hard-to-plate resins, first, a thin plating seed
layer is formed on the resin substrate as a conductive layer, and
a plating of the specified thickness is then applied by an
electroplating method. In this experiment, films with a thickness
of approximately 0.6 μm were formed using two different
methods of applying the plating seed layer (sputtering, which is
a physical method, and electroless plating using a chemical
reaction). After film-forming, a copper plating film with a target
thickness of 25 μm was formed on the respective samples by
the electroplating method.
In the measurements, the plating layer was scribed with a cutter
on a 10 mm part in the center of the 30 mm wide sample as the
peel area.
Test Sample
Table 1 Sample Information
Table 2 Instrument Configuration
Fig. 3 Range of Data Used in Calculation of Adhesion
The peel length is 60 mm or more. The adhesion of the plating
was calculated from the average test force of the data taken
from the length between the 10 mm and 60 mm after the start
of peeling. (Fig. 3). The test width and speed of the test
conditions were set referring to JIS H 8630, JIS C 6481, ASTM B
533-85 and ISO 25245. ISO 25245 specifies that the adhesion
force shall be calculated using the 30 mm length from 10 mm to
40 mm after the start of peeling as valid data. Table 3 shows the
test conditions.
Parts produced by applying platings to the surface of resins are
generally used in applications ranging from decorative parts in the
automotive industry to electrical devices and the electrical and
electronic/semiconductor fields. Since technologies for applying
platings to hard-to-plate resins have also been required for the
printed boards of automotive components and advanced
electronic equipment in recent years, a wide-range of research and
development projects are underway on topics including new resin
materials, plating chemicals, and plating production processes.
To ensure that plating films fully demonstrate their functions, films
must secure adhesion without peeling under their intended use
environments. At present, the main methods for evaluating the
adhesion of plating are the thermal cycle test and the heat shock
test, but these cannot be considered quantitative evaluation
methods. This article introduces an example in which a peel test
was conducted using a universal testing machine, and the adhesion
of the plating under various temperature environments was
quantified in accordance with ISO 25245.
Introduction
The adhesion of plating under temperature environments from -60 ˚C to 250 ˚C can be measured by using the jig and
thermostatic chamber introduced in this article.
It is possible to measure the adhesion of the plating as described in JIS H 8630, JIS C 6481 and ISO 25245.
Peel Test of Plating Film on Resin
Under Varied Temperature Environments with ISO
25245
Natsumi Koike, Hiroto Shimizu
AGX -V2 Precision Universal Testing Machine
Sample dimensions : Width 30 mm × length 100 mm × thickness 2 mm
Substrate : Polybutylene terephthalate (PBT)
Plating : Copper
Seed layer film-
forming methods
: Sputtering
Electroless plating
(a) (b)
15
10
5
0
0
20
40 60
Stroke (mm)
80
Test force (N)
Valid data range
50 mm
Invalid
data
Invalid
data
10 mm
Test speed : 25 mm/min
Set atmosphere
temperatures
: -50 ˚C, -25 ˚C, 0 ˚C, 25 ˚C, 50 ˚C, 75 ˚C, 100 ˚C,
125 ˚C
Number of tests : N = 5 (at each set atmosphere temperature)
Valid data range : 10 mm to 60 mm from start of peeling
Peel width : 10 mm
Table 3 Test Conditions
The peel test was carried out using a universal testing machine
and a thermostatic chamber. Fig. 2 shows views of the test, and
Table 2 shows the instrument configuration.
Instruments and Test Conditions
