inspeXio SMX-225CT FPD HR Plus - Applications
Microfocus X-Ray CT System
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Defect analysis identifies voids and displays a color-coded map of the voids based on their volume. It can also display a frequency histogram of scale the void volume and count.
By scanning the die cast part before machining and then specifying the surface after machining (CAD data), the software can determine which voids are removed by machining, which remain internally, and which are exposed on the surface after machining.
● Voids that are removed
● Internal voids
● Voids exposed on the surface
Provided by Ehime University
The software can align CT data with 3D-CAD data, calculate the distance between the boundary surface defined in the CT data and the corresponding 3D-CAD data, and display a color-coded map based on such differences.
For inquiries about the absorbed dose to samples such as semiconductors, please contact here.