APPLICATION

01

For Semiconductor
Devices

Due to advancements in the miniaturization and circuit integration of semiconductor devices, quality requirements for materials manufacturing environments have become much stricter. The factors that affect device performance and yield include water purity, gas purity, the cleanroom environment, and mounting quality. As a result, a wide variety of analytical and evaluation technologies are employed in the manufacturing process to evaluate organic matter in ultrapure water, analyze pollutants in the air, monitor hazardous chemical substances, check the purity of processing gases, conduct non-destructive inspection to ensure the reliability of device mounting operations, and so on.

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  Evaluation of TOC in Ultrapure Water

  The ultrapure water used to manufacture semiconductors is one of the most critical materials used when manufacturing increasingly miniaturized devices and is directly tied to device performance and yield. In particular, the organic pollutants indicated by TOC (total organic carbon) can cause pollution even at concentration levels of a few ppb or less. Therefore, it is essential to evaluate them using a TOC analyzer with especially high resolution.

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  Evaluation of TOC in Source Water, Recovered Water, and Effluent

  Due to the large volumes of water used at semiconductor manufacturing plants, it is essential to utilize water resources efficiently and reduce environmental impacts. Source water is evaluated based on determining the organic matter load and pretreatment efficiency, which are useful for deciding whether or not recovered water can be reused. For effluent water, TOC measurements are used to ensure compliance with environmental regulations or to confirm that treatment facilities are operating smoothly.

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  Simultaneous Analysis of Multiple PFAS Components in Effluent Water

  Given the increasingly strict PFAS (organofluorine substance) regulatory requirements in recent years, there is an increasing probability that PFASs are detected in effluents from semiconductor manufacturing operations. Triple quadrupole LCMS systems can quantitatively analyze multiple PFAS types simultaneously, making them an essential tool for reducing environmental impact and ensuring regulatory compliance. Monitoring PFAS compounds in effluent water from ongoing operations is also important from the perspective of both social responsibility and business sustainability.

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  Analyzing Impurities in Gases

  High-purity gases (bulk gases and various specialty gases) are used in semiconductor manufacturing processes. Impurities in these gases can directly affect yield rates and device reliability, so gas impurity levels must be monitored. By automating processes ranging from sampling to data acquisition and output, GC systems provide stable, long-term performance and enable the high accuracy, high sensitivity, and high separation analysis of gas purity.

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  Evaluating Device Mounting Reliability by Non-Destructive X-Ray Inspection

  Completed semiconductor devices are assembled into the final electronic product only after undergoing a mounting process. Voids, bridges, cracks, or other defects in solder joints used during those processes can decrease reliability. Non-destructive X-ray inspections allow internal structures to be observed without damaging them, with external inspections used to detect complex microdefects. This ensures higher mounting quality, improves yield rates, and enables faster defect analysis.

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  Analyzing Air Quality in Clean Rooms

  Due to the miniaturization of semiconductors, not only inorganic microparticles but also organic compounds generated from clean room materials, device manufacturing equipment, and human bodies increasingly need to be controlled for semiconductor manufacturing processes.

02

For Semiconductor Manufacturing Equipment

Due to the increasing miniaturization and higher integration of semiconductor devices, performance requirements for semiconductor manufacturing equipment have increased significantly. In particular, maintaining a clean and consistent processing environment, using more advanced vacuum technologies, and ensuring airtightness are essential factors that can affect yield rates and reliability. Precision control technologies and sophisticated detection technologies have been introduced to achieve stable equipment operation and high throughput, which form the foundation for advances in the semiconductor industry.

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  Improved Evacuation Pumping Performance of Semiconductor Manufacturing Equipment

  Optimizing gas evacuation systems enables process gases to be evacuated at high flowrates, which achieves lower process chamber pressures. The temperature control (heating) system and a feature that prevents process gases from flowing back to mechanical areas help extend turbomolecular pump service life and reduce running costs.

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  Maintenance of Semiconductor Manufacturing Equipment

  A leak detector equipped with a 270-degree polarized analysis cell enables high-precision and high-efficiency maintenance of semiconductor manufacturing equipment. Available as dry-type models for use in clean rooms, and as mobile models that can be freely moved around the factory. Various optional products are also available. Featuring hydrogen/helium dual-use specifications, the product lineup, which is manufactured in Japan and backed by an extensive service network, ensures safe and worry-free operation.

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