TOC Measuring of Electroplating Solution with TOC-5000A

Introduction

Organic additives are added to plating solution used in the plating process for printed circuit boards. And the additive concentration effects the drawing qualities and thermal shock of the plate. If these effects are bad, nonconformities occur like pattern peeling when the print board is bent, and cracks form in the pattern during soldering. The additive concentration changes due to mixing it into the copper plating during the plating process, adhering to the plated product, and extraction by the activated carbon process during the plating process. With Shimadzu's total organic carbon analyzer TOC-5000A, controlling the additive concentration in the plating solution improves production yields and quality.

May 29, 2000 GMT