Measurement of Lead in Lead-Free Solder by ICP-AES, FAAS and EDX

Introduction

The RoHS directive stipulates that the concentration of lead in electrical and electronic equipment be restricted to less than 1000 ppm. Therefore, lead-free solder is used to comply with this directive, and lead-free solder such as SnAgCu and SnZnBi are being used instead. Here, we introduce examples of analysis by ICP emission spectroscopy (ICP-AES), flame atomic absorption spectroscopy (FAAS), and energy dispersive X-ray fluorescence spectroscopy (EDX) of lead (Pb) in a lead-free solder sample (candidate standard NMIJ CRM 8202-a) that is used for proficiency testing by the National Metrology Institute of Japan (NMIJ) of the National Institute of Advanced Industrial Science and Technology. EDX, which permits non-destructive, quick and simple analysis of samples, is used for screening analysis, and FAAS and ICP-AES are used for precise and accurate analysis of low concentration samples. Distribution of the standard lead-free solder chip NMIJ CRM 8202-a (low Pb concentration) (Sn96.5Ag3Cu0.5), which complies green procurement guidelines, began in July 2011.

June 26, 2012 GMT