Measurement of TOC in Electroplating Solution by TOC-LCSH

Introduction

Plating solution that is used in the nickel and copper electroplating process typically contains organic additives. Because these organic additives can affect plating quality, it is important to manage these additive concentrations to ensure that product quality is maintained. Since a TOC analyzer can be used to manage the concentrations of organic material in plating solution, it can be utilized for quality management of electroplated products. As the salt concentration in plating solutions is typically more than just a few percent, this could adversely affect direct measurement using a typical combustion catalytic oxidation type TOC analyzer. Therefore, the sample must be diluted before measurement, and because the Shimadzu TOC combustion catalytic oxidation type analyzer is equipped with an automatic dilution feature, high-salt-concentration samples can be measured by automatically diluting the sample. Here, we introduce an example of measurement of a nickel plating solution containing nickel sulfamate using the Shimadzu TOC-L_CSH analyzer.

March 18, 2013 GMT