Epoxy Curing Studies with Isothermal Differential Scanning Calorimetry Method

Introduction

Epoxy resins are used for many purposes, e.g. coatings, electronic materials and adhesives due to their outstanding mechanical and electrical properties, chemical resistance, adhesion, and minimal shrinkage. Epoxy resin is thermoset and the curing process must be carried out properly since this affects the thermal and mechanical properties of the end-product. The curing of epoxy with a curing agent occurs even at low temperature but is rapid above 100 oC. The curing reaction is exothermic, thus the reaction temperature and rate can be studied by differential scanning calorimeter (DSC). Depending on the type of epoxy resin and the application of the final product, dynamic or isothermal DSC methods can be used. This application news describes an isothermal DSC method to study the curing reaction of epoxy glue.

February 4, 2020 GMT