A Soldering Defect Inspection Using the Automatic Measurement System of SMX-1000 Plus

Introduction

Various electronic components are mounted on electronic circuit boards which are indispensable for controlling electronic devices. For an electronic circuit board to operate properly, its electronic components should not have any substantial damage and the components must be appropriately bonded to it. However, defects occur at a certain rate when bonding components to electronic circuit boards. Accordingly, the inspection process serves an important role as it is through this process that defective components and soldering defects are detected and removed from the production process at an early stage and the cause of the defects are identified. The SMX-1000 Plus microfocus X-ray inspection system is useful for such defect inspections of electronic circuit boards and electronic components. Defective components and soldering defects can be detected quickly by X-ray inspections since real-time fluoroscopic images can be obtained without damaging the object that is being inspected. Furthermore, SMX-1000 Plus features an optional automatic measurement system that can make inspections more efficient. Inspections that conventionally have been performed as visual inspections can be automated by using this option. This article introduces an example of inspections that are possible using the automatic measurement system of SMX- 1000 Plus.

May 9, 2018 GMT