Xslicer SMX-6010 - Features

Microfocus X-Ray Inspection System

High-Accuracy Imaging

 Equipped with a 3 Megapixel Flat Panel Detector

Detailed internal structure and defects can be revealed due to the 3 megapixel flat panel detector (2.3 times larger than previously.

Equipped with a 3 Megapixel Flat Panel Detector

 New HDR Processing Function

Shimadzu's unique, proprietary image processing technique/algorithm allows fluoroscopic images with a higher dynamic range, Regions that are both easy and difficult to penetrate can be observed at the same time, which shortens inspection times.

New HDR Processing Function

Simple Operation

 Imaging in Three Steps

Fluoroscopic imaging in just three steps.
A large monitor screen and simple button layout provide excellent visibility for intuitive operation.
X-ray inspections are easy to perform, even for operators using the system for the first time.

Imaging in Three Steps

 Switch Smoothly between Fluoroscopy and CT

Switch between fluoroscopy and CT imaging by simply clicking on the menu tab.
The Xslicer SMX-6010 features tilted CT imaging. X-ray fluoroscopic images are captured and cross-sectional images are created by tilting the flat panel detector and rotating it 360 degrees. There is no need to install a separate unit for CT imaging.
The CT imaging scan conditions are easy to configure just by selecting the scan mode, scan angle, and scan region.
A region of interest in the fluoroscopic image can be observed immediately with a CT scan.

Switch Smoothly between Fluoroscopy and CT

 High-Speed Imaging and High-Speed Reconstruction

The calibration procedures are completely automated to speed up the imaging process.
Cross-sectional images can be displayed in as little as two minutes after CT imaging starts.

High-Speed Imaging and High-Speed Reconstruction

 Wide CT Imaging Range

CT images can be obtained at any position within a 350 mm x 350 mm area. There is no need to move the sample to the center of the rotary table as in conventional tilted CT, allowing the scan to be positioned just by clicking on the scanning site.

Wide CT Imaging Range

 Set Tracking Points Easily

If a tracking point is set, the observation position of interest when tilted and rotated never leaves the center of the window.
As a result, the point of interest is never lost.
To set a tracking point, simply tilt the detector and double click the position of interest.

Set Tracking Points Easily

Versatile, User-Friendly Functions

 Teaching Function

Fluoroscopic and CT imaging can be automated using the Teaching Function, which moves the sample stage to preregistered points of interest.
Additionally, for visual inspection, OK and NG judgment functions are included.

Teaching Function

 Stepwise Movement

The Stepwise Movement function moves the stage at constant intervals. It specifies the starting position, amount of movement, and number of movements. When this function is used, observations are performed while the stage makes consecutive movements from the starting position in accordance with the settings. Consecutive fluoroscopic or CT scans can be performed of samples arranged at set intervals.

Stepwise Movement

 Panoramic Imaging Function

A wide-range fluoroscopic image can be obtained just by specifying the imaging span on the external image. An improved stitching process ensures there are no visible lines in the panoramic image where the individual images are joined. A fluoroscopic image up to 32 megapixels in size can be obtained.

Panoramic Imaging Function

 Image Adjustment Functions (Auto Window Function and Region of Interest Function)

The contrast can be automatically optimized to make the area of interest easy to see. Normally, with this sort of optimization function, the part outside the region of interest becomes difficult to see. However, a proprietary image processing algorithm automatically adjusts the image to ensure that the part outside the region of interest remains as easy to see as possible.

Image Adjustment Functions (AW Function and Region of Interest Function)

 Ball Grid Array (BGA) Measurements

BGA bump diameters and void ratios can be measured.
With our proprietar y image proces sing algorithm, compl icated parameter set tings are unnecessary.*
Multiple settings can be saved and applicable ones can be accessed for each inspection target prior to measurement.
* Manual adjustments may be required depending on the sample.

BGA Measurements

 Area Ratio Measurements

Static Image

Die bonds, solder paste wettability, and other area ratios can be measured.
The parameter settings are not required thanks to Shimadzu's proprietary image processing algorithm.*
It is also possible to save multiple settings, and then call up the applicable settings for each inspection target prior to measurement. Furthermore, pass/fail determinations can be made based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually.

Area Ratio Measurements

 Wire Sweep Ratio Measurements

Point of Maximum Curvature

The wire sweep ratio can be measured by specifying both ends of the bonding wire and the point of maximum curvature.
Pass/fail determinations can be made depending on the wire sweep ratio.

Wire Sweep Ratio Measurements

 Dimension Measurements

The Xslicer SMX-6010 supports both 2-point distance and 3-point measurements.
With this system, sizes are measured efficiently by calculating calibration data internally in synchronization with the fluoroscopic magnification.

Size Measurements




System Configuration

 An easy-to-maintain
Shimadzu X-ray generator and various safety mechanisms
reduce costs and ensure safe use.

X-Ray Generator

The Xslicer SMX-6010 features a160-kV open tube and can resolve down to 1 micron.
Due to the integrated high-voltage transformer, no greasing is necessary.
The filament replacement process is simplified by automatic adjustments.
Note: 1 µm resolution by JIMA chart analysis.


X-Ray Detector

X-Ray Detector

Equipped with a 3 megapixel flat panel detector.


Five-Axis Stage

In addition to the X, Y, and Z axes of the sample stage, the detector tilts and rotates.
Five-axis movement supports inspections from any angle.

X-Ray Shield Box

The X-rays are well shielded. (Maximum 1 Sv/h external X-ray leakage)
The front door lock mechanism prevents the front door from opening during X-ray emission.
The interlock mechanism also disables movement of the 5-axis stage when the door is open.


Collision Sensor

A collision sensor is provided around the X-ray detector to stop the Stage in the event of an emergency (a collision with the sample).



System operation requires only the following: 200 V AC ± 10 %, 1.5 kVA (ground resistance 100 Ω max.) There is no need to provide air or cooling water.




Principles and Features of Planer CT Imaging

 Capable of Maximum Image Enlargement for Planer Samples

■Planer CT

Tilted CT

Scanning large circuit boards
with planer CT:

The sample is mounted on an XY stage, so it can approach the X-ray generator, enabling maximum image enlargement.

■Vertical CT

Orthogonal CT

Vertical CT Viewed from above the Rotary Table

Scanning large circuit boards
with vertical CT:

When the sample is brought near the X-ray generator to increase the magnification, it will be obstructed by the X-ray generator during CT imaging, making imaging at maximum magnification impossible.


 Observation Examples

For samples like circuit boards with planer CT, images with a high magnification can be obtained, unlike with orthogonal CT, which is affected by the width of the sample.

Observation Examples
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