Drill Chuck Grips
- Specifically for testing metal plates, rods and wires and electronic components
- Two types of grips: drill chuck grips for rods and drill chuck grips for flat specimens
- Models with maximum capacity up to 100 kN (22,00 lbf)
- Simple specimen mounting procedure
Metals, Electronic Components
Plates, Rods, Wires
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
Two different drill chuck grip sets, one for rods and the other for flat specimens, are available. Grip sets include upper and lower grips and a chuck key. Within each category of drill chuck grips, different capacity grips are available.
News / Events
New Autograph AGX-V2 Series Precision Universal Testing Machines
The World’s First Testing Machines Equipped with a Voice Operation Device
Given that cellulose nanofibers（CNFs）offer attractive physical characteristics, such as light weight, strength, and hardness, they not only enable materials with advanced functionality, but are expected to be used as a reinforcing material that can reduce the weight of composite materials.
Latest issue of Shimadzu Journal, featuring Materials Science, has come out.
This issue focuses on Materials Science particularly on lithium-ion batteries (LiBs). It starts with two customer interviews in which users discuss their relationship with Shimadzu.
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Shimadzu at IIW 2022
Shimadzu is honored to join the IIW 2022 International Conference on Welding and Joining (IIW 2022) as a Platinum Sponsor. Visit our booth and attend our technical program at IIW 2022!
Shimadzu has released the MIV-X Ultrasonic Optical Flaw Detector
The MIV-X visualizes and digitizes flaws (peeling, cracks, and voids) in parts and multi-materials in aircraft, automobiles, and electrical and electronic equipment using our proprietary ultrasonic optical flaw detection technology, which acquires an image of the propagation of ultrasonic on the surface of an object.