Example of Analysis of Solder Filling Using inspeXio™ SMX™-225CT FPD HR Plus X-Ray CT System

Introduction

Electronic boards are installed in many products. A large number of electronic components are mounted on boards, and solder is often used to join the electronic components to the board. The quality of solder joints not only affects the stable operation of the device, but also has a large effect on product life. Even if a product passes inspections in the manufacturing process, poor soldering quality can cause mis-operation or failure. This article introduces an example of nondestructive observation and analysis of the soldering condition and amount of solder using a Shimadzu inspeXio SMX-225CT FPD HR Plus microfocus X-ray CT system.

November 20, 2020 GMT