EDX-8100
Quantitative Analysis of Film Thicknesses of Multi-Layer Plating Used on Cards
X-Ray Analysis
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Introduction
A three-layer plating of gold (Au), nickel (Ni), and copper (Cu) is often applied to the contact areas of electronic devices and IC chips. The amount of plating material deposited (film thickness) can be measured non-destructively by using X-ray fluorescence (XRF) spectrometry. This article introduces a simple quantitative analysis of Au, Ni, and Cu film of a three-layer plating by employing the thin-film fundamental parameter (FP) method without using standard samples.
May 28, 2018 GMT
