Quantitative Analysis of Amount of Deposition and Plating Thickness: Multilayer and Irregular Shaped Samples

User Benefits

- The EDX-7200 has greater sensitivity as a result of its improved counting rate. - Multilayer platings can be analyzed as is, non-destructively. - Even irregular shaped samples can be quantified with good accuracy using the background FP (BG-FP) method.

Introduction

X-ray fluorescence spectrometers are widely used for analyzing amount of deposition and plating thickness because they can easily analyze without complex pretreatment and destruction. The new EDX-7200 enables more sensitive, faster, and higher accuracy analysis than with previous models. The performance improvements contribute to analytical throughput and faster examination. In addition, the background FP (hereinafter the BG-FP) method using Shimadzu’s proprietary scattered X-ray intensity can measure a sample such as a screw whose plated surface is not flat with the same accuracy as a flat surface. This article introduces the following. 1.Quantitative analysis of amount of deposition and plating thickness and measurement accuracy for a 3-layer sample comprised as follows: Layer 1: Gold (Au), Layer 2: Nickel (Ni), Layer 3: Copper (Cu). 2.Application to irregular shaped samples using the BG-FP method, and its measurement accuracy.

January 6, 2022 GMT