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  • Planarization in the Polishing Process

Planarization in the Polishing Process

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Planarization of Polishing Process

Polishing is a crucial step in planarizing the wafer surface, enabling the formation of fine-pitch circuit patterns.
We introduce various examples of the analysis of slurries used in the polishing process.

Planarization in the Polishing Process

  • Evaluation of Concentration of Coarse Particles in High Concentration Silica Nanoparticle Slurry: Foreign Object Detection by Dynamic Image Analysis Method
  • Approaches to Nanoparticles by SPM Observation and Size Distribution Analysis of Nanoparticles with Mixed Sizes
  • Evaluation of Microscopic Foreign Matter in CMP Slurry Using Dynamic Image Analysis and Machine Learning
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