SMX-1000 Plus/SMX-1000L Plus - Options

Microfocus X-Ray Inspection Systems

CT Systems Option

New Solutions Spring from Three Dimensional Image Analysis

With this special CT system for the SMX-1000 Plus/SMX-1000L Plus microfocus X-ray inspection systems, placing the compact CT unit on the inspection stage and switching to the special CT software enables 3D image analysis, which is not available with conventional inspection functions. In a complete departure from the complicated operating windows typical of CT systems, cross sectional images can now be obtained using simple procedures added to our popular inspection software. As a result, structural analyses of the 3D structure of electronic parts and defect analyses of specific layers can easily be confirmed.

In combination with the optional VR software, you can also create further reports with 3D representations, void quantities, and volumes.

User Interface

Main Window

Used for X-ray control and CT stage control.
The X-ray fluoroscopic image is updated and displayed in real time.
Select the parameters for the CT
radiography conditions.

Sub Window

The CT radiography results are
displayed using MPR.
Use the double slide bar to adjust the cross sectional position and brightness.
The scale display can be toggled ON/OFF.

Applications

Flexible Printed Circuit

BGA (Ball Grid Array)

Functional Options Are Available.

■ Rotating/Tilting Unit

Attach the removable rotating/tilting unit and obtain X-ray fluoroscopy images of small components from multiple angles to minimize inspection errors.

Main Specifications

 1. Max. load:  20 g
 2. Rotation:  Continuous
 3. Inclination:  ±30°

 

■ Operation Boxes

Operation Box A

Operation Box A
Combining Operation Box A with the SMX-1000 Plus/SMX-1000L Plus allows manual operation of the X-Y stage using buttons and a joystick.

Main Specifications

 1. X-Y movement:  Joystick control (6 speeds)
 2. Controls zoom ratio and tilt angle, and
    operates the rotation/inclination unit
 via buttons

 

Operation Box B

Operation Box B

Main Specifications

 1. X-Y movement:  Joystick control (6 speeds)
 2. Controls zoom ratio and tilt angle  via buttons

 

■ Seismic Unit

The Seismic Unit prepares for earthquake by incorporating to the SMX-1000 Plus and SMX-1000L Plus.
The system with this optional unit completely stops X-ray irradiation and stage movement immediately when a shake over than 80 gal occurred. This optional unit is also applicable to the existing SMX-1000 and SMX-1000L of old model.

Automatic X-Ray Measurement System for BGA Void Ratio and Area Ratio

This system allows for automatic measurement of the BGA void ratio, which is essential for X-ray inspections of mounting boards, and the area ratio (wettability) of the soldering of regulator ICs and the like. It makes possible automatic determination based on specific judgment criteria that have been set beforehand.
Samples of the same type can be measured consecutively based on predetermined settings for inspection positions of the samples placed on the stage and the inspection criteria.

Simple Operational Flow (only three steps)

No complicated parameter settings are necessary. A sample judged to be defective is marked on the external image that is taken from above the sample, making determination easy.

Simple Operational Flow (only three steps)

Easy Setup Change

Since the system combines an offline X-ray device with automatic measurement software, changing the setup is easy, making the system ideal for producing a wide variety of samples in small quantities, or for inspecting random samples.

Compact System

This space-saving system requires less than one square meter for installation. It can be installed on the side of an existing production line. The unit can also be used as an offline X-ray inspection device for a variety of purposes other than automatic measurement.

Measurement of BGA Void Ratio

Measurement of BGA Void Ratio

Measured items
(1) Total void ratio (%)
(2) Max. void ratio (%)
(3) Diameter of bumps (μm)
(4) Roundness
(5) Max. void diameter
(6) No. of bumps

Measurement time
Max 2.5 seconds per image

  • The cycle time of the system depends on the time required for stage movement and the time required to store images.


Number of points inspected
99 max.

 

Measurement of Area Ratio

Measurement of Area Ratio

Measured items
Area ratio (%)

Measurement time
Max 2.5 seconds per image

  • The cycle time of the system depends on the time required for stage movement and the time required to store images.


Number of points inspected
Max. of 99 points

 

* This system can be installed on an existing SMX-800 or SMX-1000 Plus.

Precautions

  • This system performs measurements for the images acquired by the device. The device itself is not a measurement device. For this reason, we offer no guarantees with respect to the absolute values of the measurement results.
  • Depending on the sample being inspected, this system may not be able to provide stable measurement of the sample. Before purchasing this system, be sure to check its capabilities with the sample being used.
  • Although this system can be installed to an existing SMX-800 or existing SMX-1000 Plus, a negative impact on the measurement stability could be encountered depending on the degree to which the X-ray device and detector have degraded. Before purchasing this system, make sure that the desired performance can be obtained when used with your existing equipment.
  • The product described in this document is not designed to be used by general consumers. It is intended to be used by persons who have sufficient knowledge, or who are working under the supervision of such a person.
  • The content of this document is subject to change without notice.

Automatic X-Ray Measurement System for Lithium-ion Batteries

This system allows for the automatic measurement of wiring deviations for electrodes in lithium-ion batteries during the manufacturing process. This requires a high degree of reliability, without the need for the acquisition of expensive, large-scale, in-line, specialized equipment. It makes possible automatic determination based on specific judgment criteria that have been set beforehand.
Samples of the same type can be measured consecutively based on predetermined settings for inspection positions of the samples placed on the stage and the inspection criteria.

Simple Operational Flow (only three steps)

No complicated parameter settings are necessary. A sample judged to be defective is marked on the external image that is taken from above the sample, making determination easy.

Easy Setup Change

Since the system combines an offline X-ray device with automatic measurement software, changing the setup is easy, making the system ideal for producing a wide variety of samples in small quantities, or for inspecting random samples.

Compact System

This space-saving system requires less than one square meter for installation. It can be installed on the side of an existing production line.
The unit can also be used as an offline X-ray inspection device for a variety of purposes other than automatic measurement.

Items that are necessary for inspection of wiring deviations in lithium-ion batteries are included.

■ Measured items
(1) (2) Height between different electrodes
(3) Width between electrodes
(4) Difference between different electrode heights (max.)
(5) Difference between different electrode heights (min.)
(6) Meandering width of electrode 1
(7) Meandering width of electrode 2
• Not compatible with cylindrical type batteries

■ Measurement time
Max 2.5 seconds per image

 

  • The cycle time of the system depends on the time  required for stage movement and the time required to store images.

 

■ Number of points inspected
99 max.

* This system can be installed on an existing SMX-800 or SMX-1000 Plus.

Precautions

  • This system performs measurements for the images acquired by the device. The device itself is not a measurement device. For this reason, we offer no guarantees with respect to the absolute values of the measurement results.
  • Depending on the sample being inspected, this system may not be able to provide stable measurement of the sample. Before purchasing this system, be sure to check its capabilities with the sample being used.
  • Although this system can be installed to an existing SMX-800 or existing SMX-1000 Plus, a negative impact on the measurement stability could be encountered depending on the degree to which the X-ray device and detector have degraded. Before purchasing this system, make sure that the desired performance can be obtained when used with your existing equipment.
  • The product described in this document is not designed to be used by general consumers. It is intended to be used by persons who have sufficient knowledge, or who are working under the supervision of such a person.
  • The content of this document is subject to change without notice.

Non-Destructive Testing System