Electronic Components

This is a group of instruments that can observe details with a fine focus.

Main X-Ray Test Targets

Air bubbles, cracking and joining state of BGA/CSP
Disconnection and joining state of bonding wires
Measurement of sweep ratio of bonding wires
Resin packing state

{"title":"Downloads","description":"Download the latest brochure.","source":"product","key":3580,"max":"30","filter_types":["brochures"],"link_title":"View other Downloads","link_url":"","pdf_links":[]} {"title":"Applications","source":"product","key":3580,"max":"3","filter_types":["applications","application_note","posters"],"link_title":"Learn more","link_url":false,"config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Technical Documents","source":"product","key":3580,"max":"3","filter_types":["technical","technical_reports","white_papers","primers"],"link_title":"Learn more","link_url":"#tbaleAnchor_technical","config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Manuals","source":"product","key":3580,"max":"3","filter_types":["manuals"],"link_title":"Learn more","link_url":"#tbaleAnchor_manual","config_list":[],"page_links":[],"column_title":"Documents"}

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