Ideal for Inspecting the bonding and disconnection conditions of mounting boards and LCD drivers.
Main X-Ray Test Items
- Inspection of air bubbles and bridges in solder
- Defect inspection at mounting
- Inspection of solder joints
News / Events
Shimadzu has released new bench-top X-ray Computed Tomography (CT) System XSeeker™ 8000
The XSeeker 8000 bench-top X-ray computed tomography (CT) system is equipped with a high-output X-ray generator and a high-resolution flat panel detector. Despite its compact size, it has a high X-ray output of 160 kV, enabling clear observations of molded plastic parts as well as aluminum die cast parts and other metal parts.
Shimadzu has released the Xslicer SMX-1010/1020 Microfocus X-Ray Inspection System
Shimadzu has released new Microfocus X-Ray Inspection System Xslicer SMX-6010
Shimadzu’s technology to support the research and production of ceramic filters and conductive silver paste for base stations with the advent of the 5G era
Shimadzu's New inspeXio SMX-225CT FPD HR Plus Microfocus X-Ray CT System with Improved Software Offers Higher Resolution, Improved Operability, and Lower Running Costs
The inspeXio SMX-225CT FPD HR Plus is a high-performance microfocus X-ray CT system equipped with a Shimadzu microfocus X-ray generator and a large high-resolution flat panel detector.
New XDimensus 300, Shimadzu's First Dimensional X-Ray CT System, Provides the Top Level of Measurement Accuracy and Observational Capacity in Japan
The XDimensus 300 is a dimensional X-ray CT system capable of measuring the 3D internal and external geometry of sample interiors.