Analysis of Micro Ag Particles of Lead-Free Solder

Introduction

In the electronics industry of recent years, solder joining technology has become increasingly important due to the miniaturization of electronic components and popularization of lead-free (Pb-free) solder. This article introduces the high resolution X-ray images which are possible only with FEEPMA™ and the difference in the distribution of microparticles when the accelerating voltage is changed based on an example in which a solder joint on a printed circuit board implemented with a lead-free solder (Sn-3.0Ag-0.5Cu) was analyzed using an EPMA-8050G EPMA electron probe microanalyzer.

April 2, 2020 GMT