Example of Observing Printed Circuit Board in 5G Smartphone Using a Microfocus X-Ray CT System

User Benefits

- Printed circuit boards and components in 5G smartphones can be inspected non-destructively by fluoroscopic observation. - For multi-layer components with internal structures that are difficult to observe by fluoroscopy, CT imaging enables detailed defect observation by layer and three-dimensional observation of the entire part.

Introduction

As smartphones become more powerful and widespread, the volume of data transmitted is increasing year by year, increasing the demand for large-volume, low latency data communication. the 5th Generation Mobile Communications System (5G), a communications system with ultra-high speed, ultra-low latency, and multiple simultaneous connections, was developed against this backdrop. Services for 5G smartphones were launched in the United States in 2019. Because 5G communication is only possible on compatible handsets, new smartphones are being developed and marketed as 5G becomes more widespread. To add 5G communications capabilities without sacrificing portability and functionality, it is necessary to mount many electronic components in limited board space. Against this backdrop, double-stacked structures, in which two boards capable of mounting components on both sides are stacked on top of each other, have become mainstream in recent years. The double-stacked structure increases the board area and enables more components to be mounted. However, a certain percentage of electronic components will fail. To ensure stable product operation, it is essential to inspect the quality of components and the state of the solder joints on the boards. Therefore, X-ray inspection equipment that can observe components and solder joints without damaging the product is useful for inspection. This article introduces an example of observing a double- stacked printed circuit board of a 5G smartphone using the Xslicer SMX-6010 microfocus X-ray inspection system.

April 5, 2022 GMT